JPH0443433B2 - - Google Patents

Info

Publication number
JPH0443433B2
JPH0443433B2 JP9381384A JP9381384A JPH0443433B2 JP H0443433 B2 JPH0443433 B2 JP H0443433B2 JP 9381384 A JP9381384 A JP 9381384A JP 9381384 A JP9381384 A JP 9381384A JP H0443433 B2 JPH0443433 B2 JP H0443433B2
Authority
JP
Japan
Prior art keywords
monolith
led
adhesive
manufacturing
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9381384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59231882A (ja
Inventor
Teii Doran Donarudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pitney Bowes Inc
Original Assignee
Pitney Bowes Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pitney Bowes Inc filed Critical Pitney Bowes Inc
Publication of JPS59231882A publication Critical patent/JPS59231882A/ja
Publication of JPH0443433B2 publication Critical patent/JPH0443433B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Electronic Switches (AREA)
  • Facsimile Heads (AREA)
  • Die Bonding (AREA)
  • Led Devices (AREA)
JP59093813A 1983-05-10 1984-05-10 Ｌｅｄ装置およびその製造方法 Granted JPS59231882A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US493189 1983-05-10
US06/493,189 US4566170A (en) 1983-05-10 1983-05-10 Method of producing a light emiting diode array

Publications (2)

Publication Number Publication Date
JPS59231882A JPS59231882A (ja) 1984-12-26
JPH0443433B2 true JPH0443433B2 (en]) 1992-07-16

Family

ID=23959254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59093813A Granted JPS59231882A (ja) 1983-05-10 1984-05-10 Ｌｅｄ装置およびその製造方法

Country Status (7)

Country Link
US (1) US4566170A (en])
EP (1) EP0125632B1 (en])
JP (1) JPS59231882A (en])
AU (1) AU561212B2 (en])
CA (1) CA1236908A (en])
DE (2) DE125632T1 (en])
ZA (1) ZA843526B (en])

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211972A (ja) * 1986-03-13 1987-09-17 Oki Electric Ind Co Ltd 光プリントヘツドの製造方法
US5170180A (en) * 1988-03-15 1992-12-08 Fuji Photo Film Co., Ltd. Exposure head for image recording apparatus
US5043296A (en) * 1988-03-15 1991-08-27 Siemens Aktiengesellschaft Method of manufacturing LED rows using a temporary rigid auxiliary carrier
DE3808636A1 (de) * 1988-03-15 1989-09-28 Siemens Ag Zeichengenerator fuer einen nichtmechanischen drucker
US4821051A (en) * 1988-09-01 1989-04-11 Eastman Kodak Company Optical printhead having thermal expansion stress relief
US4913526A (en) * 1988-09-01 1990-04-03 Eastman Kodak Company Optical LED printhead with lens locator bar
US4942405A (en) * 1988-10-11 1990-07-17 Hewlett-Packard Company Light emitting diode print head assembly
US5014074A (en) * 1988-10-11 1991-05-07 Hewlett-Packard Company Light emitting diode print head assembly
US5317344A (en) * 1989-12-22 1994-05-31 Eastman Kodak Company Light emitting diode printhead having improved signal distribution apparatus
DE4016698A1 (de) * 1990-05-23 1991-11-28 Siemens Ag Hilfstraeger zum uebertragen von teilen auf einen traeger und verfahren zu dessen anwendung
DE4129146A1 (de) * 1991-09-02 1993-03-04 Siemens Nixdorf Inf Syst Bandfoermiger hilfstraeger als montagehilfe fuer die zeilenweise montage von halbleiterchips auf einer passflaeche eines traegerelementes und ein zugehoeriges montageverfahren
JPH08174898A (ja) * 1994-12-27 1996-07-09 Canon Inc 露光装置
DE19816309B4 (de) * 1997-04-14 2008-04-03 CiS Institut für Mikrosensorik gGmbH Verfahren zur Direktmontage von Silizium-Sensoren und danach hergestellte Sensoren
CH695405A5 (de) 1999-12-14 2006-04-28 Esec Trading Sa Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats.
US7482638B2 (en) * 2003-08-29 2009-01-27 Philips Lumileds Lighting Company, Llc Package for a semiconductor light emitting device
US7942551B2 (en) 2006-04-25 2011-05-17 Koninklijke Philips Electronics N.V. LED array grid, method and device for manufacturing said grid and LED component for use in the same
US20150094550A1 (en) * 2013-09-30 2015-04-02 General Electric Company Dual-spectra pulse oximeter sensors and methods of making the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3558974A (en) * 1968-04-30 1971-01-26 Gen Electric Light-emitting diode array structure
US3860949A (en) * 1973-09-12 1975-01-14 Rca Corp Semiconductor mounting devices made by soldering flat surfaces to each other
US4455562A (en) * 1981-08-14 1984-06-19 Pitney Bowes Inc. Control of a light emitting diode array
CA1115852A (en) * 1980-01-09 1982-01-05 Jacques R. St. Louis Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices
CA1175884A (en) * 1980-06-25 1984-10-09 Hugh St. L. Dannatt Light emitting diode assembly

Also Published As

Publication number Publication date
DE125632T1 (de) 1985-04-11
ZA843526B (en) 1984-12-24
EP0125632A1 (en) 1984-11-21
CA1236908A (en) 1988-05-17
DE3465150D1 (en) 1987-09-03
JPS59231882A (ja) 1984-12-26
AU2767284A (en) 1984-11-15
AU561212B2 (en) 1987-04-30
US4566170A (en) 1986-01-28
EP0125632B1 (en) 1987-07-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees